Microsectional / Cross-Section Analysis of electronic devices (ICs (Integrated Circuits) 

In electronics, Microsection analysis is most widely accepted for analyzing IC / PCB /PWB. It allows to visual inspection at the plane that cuts through the sample at nanometer-scale of microstructures and is destructive technique. They are commonly one for research, Failure analysis, Assurance of manufacturing quality, lot verification or vendor qualification. NRPL has the knowledge and experience to provide the highest quality services ad least turnaround time. Microsectioning of the electronic device / Sample can provide more details of quality of the manufacturing process, when coupled with elemental analysis techniques like SEM/EDS systems. The quality of the manufacturing process can be fully characterized and provide guidance for improvement of the manufacturing process.

Microsectioning is generally done for following

Analytical techniques for Microsectioning

Microsectioning can also reveal quality and extent of soldering process. This analysis aids in determining soldering defects, which could lead to solder failure and fatigue. It also helps in microscopic and morphological evaluation of cracks their by identification of the stress and finally the root cause of solder connection failure can be one.

Microsectioning inspections

Microsectioning involves examining the connections of different electronic devices composed of different materials. Microsectioning is achieved majorly by grinding and polishing which various from sample to sample. Microsectioning is mainly dependent on hardness and ductility of the materials to grind, electronic components. Grinding parameters including rotation speed, pressure and time and abrasive material used will be optimized.

Electronic components

Visualizing the internal structures of the electronic devices by Microsectioning can reveal the issues associated with manufacturing and material quality. Microsectioning of IC ca reveals the die and its number of layers, die paddle an interconnections of wire bonds or solder bumps.

Solder connections

Polished microsections can be evaluated further for variety of analytical techniques. High resolution images will be captured using optical microscope or scanning electron microscope (SEM). Compositional / Chemical analysis can be performed with energy dispersive X-ray spectroscopy (EDS)

Other applications of Microsectioning includes following

• PCB analysis
• Structural integrity analysis
• Coating thickness
• Chemical analysis
• Intermetallic layer measurements
• Cross sectional analysis
• Plating Thickness
• Number of layers in IC