Integrated Circuit Decapsulation

Integrated CircuitDecapsulation

Integrated Circuit (IC) devices are packaged in black boxes to protect the chip from the environment and to provide a standard outline for Printed Circuit Board (PCB) design and automatic pick and place. Chip, supporting leadframe and interconnection components are encapsulated inside the IC package. Epoxy molding compound is the most widely used material for IC encapsulation due to the low cost and good performance.

IC failure analysis may require looking into chips, wires, and devices that do not allow for observation of their internal parts because of their external package covering (Epoxy). The external layers blocking observation may be removed by proprietary techniques (chemical) etching to uncover the devices packaged inside for further treatment and observation during testing.

Reasons for Decaping of Chip

Failure analysis
Identifying Counterfeit Chips
Resetting Lock Bits
Reading Out a Masked ROM
Optical Fault Injection
Microprobing

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IC decapsulation is a unique blend of art and science, as certain degree of creativity and Knowledge of chemicals is necessary

Decaping is the process of removing the black packaging material, which makes up a microchip in order to expose the silicon chip inside. The silicon chip inside is where all of the processing happens and is where the data is stored. In the case of a microcontroller, the kind you would find in most electronic devices, it is also where the firmware is stored.

In silicon chip, many secrets of integrated circuits are hidden, an analyst looking to uncover a failure. One has to extract silicon die and each layer has to be captured during the process to figure out failures. For microprocessors, there can be a different metal routing layers. Capturing of images can be done using normal optical microscopes to sophisticated instruments like SEM / TEM.

OM Images of decapsulated ICs

Nishka Research uses proprietary techniques (trade secrets) for IC decapsulation to evaluate failure analysis. Specialized facility are used for decapsulation of ICs. Based on its expertise and proprietary technique, Nishka Research is able to provide the optimum decaping method specific to individual packaged IC to prepare for easy testing. For more details, please contact us.

Package Decap: LED, gallium arsenide IC, automotive IC, optical coupling IC
Special Decap: Backside, MEMS, packaging material preparation, various kinds of packaging removal
Chemical Etching Analysis: Crater test, solder oil / stain removal, photo resistance removal by chemical etching, pin cleaning

Applications

Component Authenticity Verification
Counterfeit Component Analysis
Integrated Circuit Failure Analysis

Why Nishka Research?

At NRPL, we specialize in the delicate and critical process of IC decapsulation using proprietary chemical etching techniques. Our expert team combines scientific precision with deep domain knowledge to safely remove encapsulating materials like epoxy without damaging the internal silicon die—enabling accurate analysis and failure diagnostics.

Our state-of-the-art lab is equipped to handle a wide variety of IC packages, including complex microcontrollers, MEMS, and automotive-grade chips. Whether it’s failure analysis, counterfeit detection, or extracting masked ROM data, our decapsulation methods are tailored for precision, safety, and repeatability.

What sets NRPL apart is our ability to adapt decap techniques based on chip type and failure mode. From optical microscopy to SEM/TEM imaging, we offer complete visualization and analysis support. With proven expertise and trusted trade-secret techniques, NRPL ensures accurate results for the most sensitive microelectronic investigations.

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Integrated Circuit Decapsulation