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Integrated Circuit Decapsulation

Integrated Circuit Decapsulation

Integrated Circuit (IC) devices are packaged in black boxes to protect the chip from the environment and to provide a standard outline for Printed Circuit Board (PCB) design and automatic pick and place. Chip, supporting leadframe and interconnection components are encapsulated inside the IC package. Epoxy molding compound is the most widely used material for IC encapsulation due to the low cost and good performance.

IC failure analysis may require looking into chips, wires, and devices that do not allow for observation of their internal parts because of their external package covering (Epoxy). The external layers blocking observation may be removed by proprietary techniques (chemical) etching to uncover the devices packaged inside for further treatment and observation during testing.

IC decapsulation is a unique blend of art and science, as certain degree of creativity and Knowledge of chemicals is necessary
OM Images of decapsulated ICs
OM Images of decapsulated ICs

Decaping is the process of removing the black packaging material, which makes up a microchip in order to expose the silicon chip inside. The silicon chip inside is where all of the processing happens and is where the data is stored. In the case of a microcontroller, the kind you would find in most electronic devices, it is also where the firmware is stored.

In silicon chip, many secrets of integrated circuits are hidden, an analyst looking to uncover a failure. One has to extract silicon die and each layer has to be captured during the process to figure out failures. For microprocessors, there can be a different metal routing layers. Capturing of images can be done using normal optical microscopes to sophisticated instruments like SEM / TEM.

NRPL uses proprietary techniques (trade secrets) for IC decapsulation to evaluate failure analysis. Specialized facility are used for decapsulation of ICs. Based on its expertise and proprietary technique, NRPL is able to provide the optimum decaping method specific to individual packaged IC to prepare for easy testing. For more details, please contact us.
Reasons for decaping of a chip.
  • Failure analysis
  • Identifying Counterfeit Chips
  • Resetting Lock Bits
  • Reading Out a Masked ROM
  • Optical Fault Injection
  • Microprobing
Package decap
LED, gallium arsenide IC, automotive IC, optical coupling IC
Special decap
backside, MEMS, packaging material preparation, various kinds of packaging removal
Chemical etching analysis
crater test, solder oil / stain removal, photo resistance removal by chemical etching, pin cleaning

Applications :

  • Component Authenticity Verification
  • Counterfeit Component Analysis
  • Integrated Circuit Failure Analysis

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